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Soder-Wick No Clean Desoldering Wick - 16035

RM99.00

Quantity: In Stock


Quantity:


Packging
10 pcs/ pack

Wick Size #3 Green
0.08" / 2.0mm - best for medium pads

5' / 1.5m L, ESD-safe bobbin 10 bobbins per resealable pouch

Soder-Wick No Clean desoldering wick is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean desoldering wick uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. 

Soder-Wick brand desoldering wick offers the state of the art in desoldering technology. Soder-Wick is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.

Features & Benefits
  • Patented noncorrosive, halide free, organic no-clean flux
  • Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
  • Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance
Specification
  • MIL-F-14256 F
  • NASA-STD-8739.3 Soldered Electrical Connections
  • DOD-STD-883E, Method 2022
  • ANSI/IPC J STD-004, Type ROL0
  • Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
  • Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderabilit


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